SMD Reflow Oven
Team Members Heading link
- Richie Kaman
- Vaibhav Kumbhani
- Kaleem Mohammed
- Shiv Nigam
Project Description Heading link
SMD Reflow Ovens offer immense thermal transfer efficiency, with even heat distribution so that the soldering process is done accurately and consumes less resources to mount electrical components. Commercial systems are rich with features, but overpriced and bulky by design. The purpose of this project was to develop a reflow soldering oven for printed circuit boards suitable for use in small batch prototyping in Engineering Lab at the University of Illinois at Chicago. Our team has created an SMD reflow oven by retrofitting a consumer convection oven and adding the core features and components necessary for PCB soldering of comparable proportional performance. Using a pre-built convection oven, the group intends on measuring the efficiency by how well the machine can output soldered PCBs in comparison to a larger oven. Our oven will be smaller, but portable enough to be able to carry around. This means that the circuit boards that can be soldered from this toaster oven will be much smaller than what a typical aftermarket oven can perform.
See supporting documentation in the team’s Box drive.